Southeast Asia Redistribution Layer Material Market Size and Forecasts (2020-2030)
Southeast Asia Redistribution Layer Material Market Size and Forecasts (2020 – 2030), Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others) and Application (Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others])
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Description
The redistribution layer (RDL) is the thin film or layer of conductive material used to route and redistribute electrical signals within an integrated circuit (IC) or semiconductor device. This layer is essential for connecting components, such as transistors, capacitors, and resistors, within the IC and ensuring that signals can flow efficiently between them. Southeast Asia is strategically positioned to benefit from this demand. The region has emerged as a semiconductor manufacturing and assembly hub, with countries such as Malaysia, Vietnam, and Thailand hosting significant facilities. The proximity of these production centers to the key industries means that sourcing redistribution layer materials is efficient and cost-effective. Additionally, the economic growth of the automotive and telecommunications sectors has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region’s strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the Southeast Asia redistribution layer material market growth.
In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in Southeast Asia are positioned to capitalize on this trend by producing and supplying the necessary materials. Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Southeast Asia redistribution layer material market growth. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity. Southeast Asia can leverage semiconductor manufacturing expertise to supply the critical redistribution layer materials required for these advanced packaging techniques.
These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Southeast Asia can play a pivotal role in delivering these advanced materials to meet global industry demands. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials. Southeast Asia’s strong presence in automotive electronics manufacturing positions it as a key contributor to the Southeast Asia redistribution layer material market growth.
Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Southeast Asia redistribution layer material market growth.
A few key players operating in the Southeast Asia redistribution layer material market are Advanced Semiconductor Engineering, Inc; Amkor Technology; Fujifilm Corporation; DuPont; Infineon Technologies AG; NXP Semiconductors; Samsung Electronics Co., Ltd; Shin-Etsu Chemical Co., Ltd; SK Hynix Inc; and Jiangsu Changjiang Electronics Technology Co., Ltd. Players operating in the Southeast Asia redistribution layer material market are highly focused on developing high-quality and innovative product offerings to fulfill customers’ requirements.
The overall Southeast Asia redistribution layer material market size has been derived using both primary and secondary sources. Exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Southeast Asia redistribution layer material market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights into the topic. The participants of this process include industry experts, such as VPs, business development managers, market intelligence managers, and national sales managers—along with external consultants, such as valuation experts, research analysts, and key opinion leaders—specializing in the Southeast Asia redistribution layer material market.
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The Southeast Asia redistribution layer material market is expected to grow from US$ 54.51 million in 2022 to US$ 150.11 million by 2030; it is expected to register a CAGR of 13.5% from 2022 to 2030.
The redistribution layer (RDL) is the thin film or layer of conductive material used to route and redistribute electrical signals within an integrated circuit (IC) or semiconductor device. This layer is essential for connecting components, such as transistors, capacitors, and resistors, within the IC and ensuring signals can flow effectively between them. The Southeast Asia redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication. The ever-expanding production needs of the automotive industry propel the growth of the market. According to the ISEAS-Yusof Ishak Institute, Southeast Asia is also an important automobile production base. Southeast Asia is the seventh largest automotive manufacturing hub worldwide, producing 3.5 million vehicles in 2021. Within the region, Thailand is the largest car producer, producing over 1.6 million motor vehicles in 2021, followed by Indonesia (1.1 million), Malaysia (0.48 million), and Vietnam (0.16 million). As vehicles become increasingly reliant on advanced electronics for safety, entertainment, and autonomous capabilities, the demand for semiconductors has soared. These automotive chips require intricate packaging solutions, often employing redistribution layers, to enable compact design and efficient interconnections.
The telecommunication sector is evolving rapidly, particularly with the deployment of 5G technology. There is a widespread rollout of 5G networks in Southeast Asian countries, which has led to an increased demand for smartphones and other consumer electronics products. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS’s 5G standalone (SA) network in Thailand. In Vietnam, Samsung Electronics and Viettel announced the 5G commercial trials launched in Da Nang in December 2021. Viettel is piloting 5G services in 11 provinces and cities, namely, Ho Chi Minh City, Hanoi, Bac Ninh, Vinh Phuc, Bac Giang, Dong Nai, Ba Ria-Vung Tau, Binh Phuoc, Thua Thien-Hue, and Da Nang. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. Smaller, more powerful devices are in demand, necessitating thinner and more advanced redistribution layer materials. These materials play a critical role in enabling high-density interconnections within compact electronic packages. All these factors are driving the Southeast Asia redistribution layer material market growth.
Advanced Semiconductor Engineering, Inc.; Amkor Technology; Fujifilm Corporation; DuPont; Infineon Technologies AG; NXP Semiconductors; Samsung Electronics Co., Ltd; Shin-Etsu Chemical Co., Ltd; SK Hynix Inc; and Jiangsu Changjiang Electronics Technology Co., Ltd are among the key players operating in the Southeast Asia redistribution layer material market.
The market is reviving due to the government’s significant measures, such as vaccination drives. The growing demand for redistribution layer material from the semiconductor sector is propelling the Southeast Asia redistribution layer material market growth. Moreover, various players in the country are seeking more investment opportunities as businesses gain confidence in stabilizing economies and increasing demand, thereby providing the impetus for the Southeast Asia redistribution layer material market share.
The “Southeast Asia Redistribution Layer Material Market Analysis to 2030” is a specialized and in-depth study of the chemicals & materials industry, focusing on the Southeast Asia redistribution layer material market trend analysis. The report aims to provide an overview of the market with detailed market segmentation. The Southeast Asia redistribution layer material market is divided on the basis of type and application. Based on type, the market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. Based on application, the market is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC packaging (High Bandwidth Memory (HBM), multi-chip integration, Package on Package (FOPOP), and others). In 2022, the polyimide (PI) segment dominated the Southeast Asia redistribution layer material market. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry. Polyimide is majorly used in all the flip-chip wafer bumping and WLP applications. The polyimide dielectric materials have been conventionally serving as Stress-Buffer Passivation Layers (SBP) on the ICs, which used to be wire-bonded and wrapped in a mold compound. All these factors are boosting the growth of the Southeast Asia redistribution layer material market for the polyimide (PI) segment.
o Progressive industry trends in the Southeast Asia redistribution layer material market to help players develop effective long-term strategies
o Business growth strategies adopted by developed and developing markets
o Quantitative analysis of the Southeast Asia redistribution layer material market from 2020 to 2030
o Estimation of the demand for redistribution layer material across various industries
o Porter’s five forces analysis provide a 360-degree view of the Southeast Asia redistribution layer material market
o Recent developments to understand the competitive market scenario and the demand for redistribution layer material in the Southeast Asia scenario.
o Market trends and outlook coupled with factors driving and restraining the growth of the Southeast Asia redistribution layer material market.
o Decision-making process by understanding strategies that underpin commercial interest concerning the Southeast Asia redistribution layer material market growth
o The Southeast Asia redistribution layer material market size at various nodes of market
o Detailed overview and segmentation of the Southeast Asia redistribution layer material market as well as its dynamics in the industry
o The Southeast Asia redistribution layer material market size in different regions with promising growth opportunities
TABLE OF CONTENTS
1. Introduction 12
1.1 The Research Team Report Guidance. 12
1.2 Market Segmentation. 13
2. Executive Summary 14
2.1 Key Insights. 14
2.2 Market Attractiveness. 15
3. Research Methodology 16
3.1 Coverage. 17
3.2 Secondary Research. 18
3.3 Primary Research. 18
4. Southeast Asia Redistribution Layer Material Market Landscape 19
4.1 Overview. 19
4.2 Porter’s Five Forces Analysis. 20
4.2.1 Bargaining Power of Suppliers. 20
4.2.2 Bargaining Power of Buyers. 21
4.2.3 Threat of New Entrants. 21
4.2.4 Intensity of Competitive Rivalry. 21
4.2.5 Threat of Substitutes. 22
4.3 Ecosystem Analysis. 23
4.3.1 Raw Material Suppliers. 23
4.3.2 Manufacturers. 23
4.3.3 End Use. 24
4.3.4 List of Vendors in the Value Chain: 25
5. Southeast Asia Redistribution Layer Material Market – Key Market Dynamics 27
5.1 Market Drivers. 27
5.1.1 Growing Focus on AI-based Equipment and Tools. 27
5.1.2 Increasing Demand from Automotive and Telecommunication Industries. 28
5.2 Market Restraints. 29
5.2.1 Fluctuation in Raw Material Prices. 29
5.3 Market Opportunities. 30
5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals. 30
5.4 Future Trends. 30
5.4.1 Advancements in the Packaging Technology. 30
5.5 Impact Analysis. 32
6. Redistribution Layer Material Market – Southeast Asia Market Analysis 33
6.1 Southeast Asia Redistribution Layer Material Market Revenue (US$ Million) 33
6.2 Southeast Asia Redistribution Layer Material Market Volume (Tons) 34
6.3 Southeast Asia Redistribution Layer Material Market Forecast and Analysis. 35
7. Southeast Asia Redistribution Layer Material Market Analysis – Type 36
7.1 Polyimide (PI) 38
7.1.1 Overview. 38
7.1.2 Polyimide (PI) Market Revenue and Forecast to 2030 (US$ Million) 38
7.1.3 Polyimide (PI) Market Volume and Forecast to 2030 (Tons) 39
7.2 Polybenzoxazole (PBO) 39
7.2.1 Overview. 39
7.2.2 Polybenzoxazole (PBO) Market Revenue and Forecast to 2030 (US$ Million) 40
7.2.3 Polybenzoxazole (PBO) Market Volume and Forecast to 2030 (Tons) 40
7.3 Benzocylobutene (BCB) 41
7.3.1 Overview. 41
7.3.2 Benzocylobutene (BCB) Market Revenue and Forecast to 2030 (US$ Million) 41
7.3.3 Benzocylobutene (BCB) Market Volume and Forecast to 2030 (Tons) 42
7.4 Others. 42
7.4.1 Overview. 42
7.4.2 Others Market Revenue and Forecast to 2030 (US$ Million) 43
7.4.3 Others Market Volume and Forecast to 2030 (Tons) 44
8. Southeast Asia Redistribution Layer Material Market Analysis – Application 45
8.1 Fan-Out Wafer Level Packaging (FOWLP) 46
8.1.1 Overview. 46
8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market Revenue, and Forecast to 2030 (US$ Million) 47
8.2 2.5D/3D IC Packaging. 48
8.2.1 Overview. 48
8.2.2 2.5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million) 48
9. Southeast Asia Redistribution Layer Material Market – Geographical Analysis 49
9.1 Southeast Asia Redistribution Layer Material Market 49
9.1.1 Overview. 49
9.1.2 Southeast Asia Redistribution Layer Material Market Breakdown by Country. 50
9.1.2.1 Redistribution Layer Material Market Breakdown by Country. 50
9.1.2.2 Indonesia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 50
9.1.2.3 Indonesia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 51
9.1.2.3.1 Indonesia Redistribution Layer Material Market Breakdown by Type. 52
9.1.2.3.2 Indonesia Redistribution Layer Material Market Breakdown by Application. 53
9.1.2.4 Singapore Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 54
9.1.2.5 Singapore Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 54
9.1.2.5.1 Singapore Redistribution Layer Material Market Breakdown by Type. 55
9.1.2.5.2 Singapore Redistribution Layer Material Market Breakdown by Application. 56
9.1.2.6 Malaysia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 57
9.1.2.7 Malaysia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 57
9.1.2.7.1 Malaysia Redistribution Layer Material Market Breakdown by Type. 58
9.1.2.7.2 Malaysia Redistribution Layer Material Market Breakdown by Application. 59
9.1.2.8 Taiwan Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 60
9.1.2.9 Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 60
9.1.2.9.1 Taiwan Redistribution Layer Material Market Breakdown by Type. 61
9.1.2.9.2 Taiwan Redistribution Layer Material Market Breakdown by Application. 62
9.1.2.10 Thailand Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 63
9.1.2.11 Thailand Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 63
9.1.2.11.1 Thailand Redistribution Layer Material Market Breakdown by Type. 64
9.1.2.11.2 Thailand Redistribution Layer Material Market Breakdown by Application. 65
9.1.2.12 Vietnam Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 66
9.1.2.13 Vietnam Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 66
9.1.2.13.1 Vietnam Redistribution Layer Material Market Breakdown by Type. 67
9.1.2.13.2 Vietnam Redistribution Layer Material Market Breakdown by Application. 68
9.1.2.14 Rest of Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 69
9.1.2.15 Rest of Southeast Asia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 69
9.1.2.15.1 Rest of Southeast Asia Redistribution Layer Material Market Breakdown by Type. 70
9.1.2.15.2 Rest of Southeast Asia Redistribution Layer Material Market Breakdown by Application. 71
10. Impact of COVID-19 Pandemic on Southeast Asia Redistribution Layer Material Market 72
10.1 Pre & Post Covid-19 Impact 72
11. Competitive Landscape 73
11.1 Heat Map Analysis By Key Players. 73
11.2 Company Positioning & Concentration. 73
12. Industry Landscape 74
12.1 Overview. 74
12.2 Market Initiative. 74
12.3 New Product Development 75
12.4 Merger and Acquisition. 75
13. Company Profiles 76
13.1 SK Hynix Inc. 76
13.1.1 Key Facts. 76
13.1.2 Business Description. 76
13.1.3 Products and Services. 77
13.1.4 Financial Overview. 77
13.1.5 SWOT Analysis. 79
13.1.6 Key Developments. 79
13.2 Samsung Electronics Co Ltd. 80
13.2.1 Key Facts. 80
13.2.2 Business Description. 80
13.2.3 Products and Services. 81
13.2.4 Financial Overview. 81
13.2.5 SWOT Analysis. 83
13.2.6 Key Developments. 83
13.3 Infineon Technologies AG. 84
13.3.1 Key Facts. 84
13.3.2 Business Description. 84
13.3.3 Products and Services. 85
13.3.4 Financial Overview. 85
13.3.5 SWOT Analysis. 87
13.3.6 Key Developments. 87
13.4 DuPont de Nemours Inc. 88
13.4.1 Key Facts. 88
13.4.2 Business Description. 88
13.4.3 Products and Services. 89
13.4.4 Financial Overview. 89
13.4.5 SWOT Analysis. 91
13.4.6 Key Developments. 91
13.5 FUJIFILM Holdings Corp. 92
13.5.1 Key Facts. 92
13.5.2 Business Description. 92
13.5.3 Products and Services. 93
13.5.4 Financial Overview. 93
13.5.5 SWOT Analysis. 95
13.5.6 Key Developments. 95
13.6 Amkor Technology Inc. 96
13.6.1 Key Facts. 96
13.6.2 Business Description. 96
13.6.3 Products and Services. 97
13.6.4 Financial Overview. 97
13.6.5 SWOT Analysis. 99
13.6.6 Key Developments. 99
13.7 ASE Technology Holding Co Ltd. 100
13.7.1 Key Facts. 100
13.7.2 Business Description. 100
13.7.3 Products and Services. 101
13.7.4 Financial Overview. 101
13.7.5 SWOT Analysis. 103
13.7.6 Key Developments. 103
13.8 NXP Semiconductors NV. 104
13.8.1 Key Facts. 104
13.8.2 Business Description. 104
13.8.3 Products and Services. 105
13.8.4 Financial Overview. 105
13.8.5 SWOT Analysis. 107
13.8.6 Key Developments. 107
13.9 JCET Group Co Ltd. 108
13.9.1 Key Facts. 108
13.9.2 Business Description. 108
13.9.3 Products and Services. 108
13.9.4 Financial Overview. 109
13.9.5 SWOT Analysis. 110
13.9.6 Key Developments. 111
13.10 Shin-Etsu Chemical Co Ltd. 112
13.10.1 Key Facts. 112
13.10.2 Business Description. 112
13.10.3 Products and Services. 113
13.10.4 Financial Overview. 113
13.10.5 SWOT Analysis. 114
13.10.6 Key Developments. 115
14. Appendix 116
LIST OF TABLES
Table 1. Southeast Asia Redistribution Layer Material Market Segmentation. 13
Table 2. List of Raw Material Suppliers in Value Chain. 25
Table 3. List of Manufacturers in Value Chain. 26
Table 4. Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 35
Table 5. Southeast Asia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 35
Table 6. Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 36
Table 7. Southeast Asia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 37
Table 8. Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 45
Table 9. Indonesia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 52
Table 10. Indonesia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 52
Table 11. Indonesia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 53
Table 12. Singapore Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 55
Table 13. Singapore Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 55
Table 14. Singapore Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 56
Table 15. Malaysia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 58
Table 16. Malaysia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 58
Table 17. Malaysia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 59
Table 18. Taiwan Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 61
Table 19. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 61
Table 20. Taiwan Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 62
Table 21. Thailand Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 64
Table 22. Thailand Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 64
Table 23. Thailand Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 65
Table 24. Vietnam Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 67
Table 25. Vietnam Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 67
Table 26. Vietnam Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 68
Table 27. Rest of Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type. 70
Table 28. Rest of Southeast Asia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type. 70
Table 29. Rest of Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application. 71
Table 30. Company Positioning & Concentration. 73
LIST OF FIGURES
Figure 1. Southeast Asia Redistribution Layer Material Market Segmentation, By Country. 13
Figure 2. Southeast Asia Redistribution Layer Material Market – Porter’s Analysis. 20
Figure 3. Ecosystem: Southeast Asia Redistribution Layer Material Market 23
Figure 4. Market Dynamics: Southeast Asia Redistribution Layer Material Market 27
Figure 5. Southeast Asia Redistribution Layer Material Market Impact Analysis of Drivers and Restraints. 32
Figure 6. Southeast Asia Redistribution Layer Material Market Revenue (US$ Million), 2020 – 2030. 33
Figure 7. Southeast Asia Redistribution Layer Material Market Volume (Tons), 2020 – 2030. 34
Figure 8. Southeast Asia Redistribution Layer Material Market Share (%) – Type, 2022 and 2030. 36
Figure 9. Polyimide (PI) Market Revenue and Forecasts To 2030 (US$ Million) 38
Figure 10. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons) 39
Figure 11. Polybenzoxazole (PBO) Market Revenue and Forecasts To 2030 (US$ Million) 40
Figure 12. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons) 40
Figure 13. Benzocylobutene (BCB) Market Revenue and Forecasts To 2030 (US$ Million) 41
Figure 14. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons) 42
Figure 15. Others Market Revenue and Forecasts To 2030 (US$ Million) 43
Figure 16. Others Market Volume and Forecasts To 2030 (Tons) 44
Figure 17. Southeast Asia Redistribution Layer Material Market Share (%) –Application, 2022 and 2030. 45
Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts To 2030 (US$ Million) 47
Figure 19. 2.5D/3D IC Packaging Market Revenue and Forecasts To 2030 (US$ Million) 48
Figure 20. Southeast Asia Redistribution Layer Material Market Breakdown By Key Countries, 2022 And 2030 (%) 50
Figure 21. Indonesia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 50
Figure 22. Indonesia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 51
Figure 23. Singapore Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 54
Figure 24. Singapore Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 54
Figure 25. Malaysia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 57
Figure 26. Malaysia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 57
Figure 27. Taiwan Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 60
Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 60
Figure 29. Thailand Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 63
Figure 30. Thailand Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 63
Figure 31. Vietnam Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 66
Figure 32. Vietnam Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 66
Figure 33. Rest of Southeast Asia Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) 69
Figure 34. Rest of Southeast Asia Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) 69
Figure 35. Heat Map Analysis By Key Players. 73
The List of Companies – Southeast Asia Redistribution Layer Material Market
o Advanced Semiconductor Engineering, Inc
o Amkor Technology
o Fujifilm Corporation
o DuPont
o Infineon Technologies AG
o NXP Semiconductors
o Samsung Electronics Co., Ltd
o Shin-Etsu Chemical Co., Ltd
o SK Hynix Inc
o Jiangsu Changjiang Electronics Technology Co., Ltd
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