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Europe Redistribution Layer Material Market Forecast to 2030
Europe Redistribution Layer Material Market Forecast to 2030 – Regional Analysis – By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application {Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]}
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Description
Advancements in the Packaging Technology Drive Europe Redistribution Layer Material Market
In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in across the globe are positioned to capitalize on this trend by producing and supplying the necessary materials.
Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Europe redistribution layer material market. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity.
These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials.
Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Europe redistribution layer material market growth.
Europe Redistribution Layer Material Market Overview
Europe has a wide presence of major manufacturing industries such as aerospace, machinery & equipment, automotive, shipbuilding, and military vehicles. The automotive industry of the EU is considered to be a crucial industry as it significantly contributes to the region’s GDP. EU is the leading producer of motor vehicles across the globe, and many premium automotive manufacturers such as BMW, Volkswagen are based in the region. In the region, the vehicle manufacturing sector produces ~19.2 million cars, vans, buses, and trucks per year. Approximately 300 vehicle assembly and manufacturing facilities are located in ~26 countries across the region. According to the European Automobile Manufacturers’ Association (ACEA), 21% of the cars across the world are manufactured in the EU by companies such as BMW, Volkswagen, Audi, and Aston Martin. Germany holds the largest share of the automotive market in the region, i.e., 30%. The rapid inclination of automotive manufacturers to include automotive electronics due to the emergence of autonomous driving and advanced driver-assist systems has resulted in increased demand for electronic integrations in automobiles. This factor propels the demand for semiconductor materials, including redistribution layer materials.
BYD Auto Co., Ltd, China, announced its plan in 2021 to establish a battery production plant in Europe. Furthermore, Hungary and the Czech Republic are among the key export markets for semiconductors owing to the presence of several electronic equipment manufacturers. With the growing demand for electronic equipment in Europe, the adoption of semiconductor packaging technology is also increasing. The 5G for Europe Action Plan of the EC is a blueprint for private as well as public investment in 5G infrastructure in the EU. The blueprint enumerates measures to ensure a synchronized approach among all EU Member States to make 5G available to all citizens by the end of 2020. This plan has propelled the Europe redistribution layer material market growth across Europe. Additionally, manufacturers are working on projects to launch highly efficient packaging of larger chips. For instance, in Germany, Fraunhofer IZM is leading a project to improve Fan-Out Panel Level Packaging technology for packaging larger chips with higher efficiency. Also, as a part of advanced packaging, the fan-out solutions are likely to become critical for boosting device performance and bandwidth. This factor is encouraging semiconductor players, R&D organizations, and chipmakers to promote the development of fan-out packaging solutions. All the above mentioned factors are anticipated to support the growth of the Europe redistribution layer material market during the forecast period.
Europe Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)
Europe Redistribution Layer Material Market Segmentation
The Europe redistribution layer material market is segmented based on type, application, and country.
Based on type, the Europe redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.
By application, the Europe redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held the largest share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.
Based on country, the Europe redistribution layer material market is segmented into Germany, Austria, Italy, and the Rest of Europe. Germany dominated the Europe redistribution layer material market in 2022.
SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Europe redistribution layer material market.
Summary Info
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According to the Research Team’ research, the Europe redistribution layer material market was valued at US$ 15.62 million in 2022 and is expected to reach US$ 34.45 million by 2030, registering a CAGR of 10.4% from 2022 to 2030. Proliferation of IoT and connected devices across industry verticals and advancements in the packaging technology are among the critical factors attributed to the Europe redistribution layer material market expansion.
The Internet of Things (IoT) market across the globe has gained considerable popularity recently, with businesses acknowledging the significance of connectivity. IoT has enabled each device to be connected to the Internet. According to the International Data Corporation (IDC), 41.6 billion IoT devices will be in 2025, capable of generating 79.4 zettabytes (ZB) of data. This exponential increase in data traffic over the internet is due to the increasing penetration of smartphones and other consumer electronics that can be connected to the internet due to the rising popularity of IoT.
IoT encompasses a wide range of applications, from smart homes and wearable devices to industrial automation and smart cities. These applications rely on small, power-efficient, highly integrated semiconductor components, often requiring complex packaging solutions. Redistribution layers play a crucial role in these packaging technologies, enabling the miniaturization of devices, efficient interconnection, and the integration of various functions into a single chip package. IoT devices are being deployed across industry verticals across the globe, such as manufacturing, healthcare, agriculture, and logistics, to enhance efficiency, monitor processes, and gather data for informed decision-making. These devices demand advanced semiconductor packaging to withstand challenging environments and provide reliable performance.
Businesses across almost all industry verticals have realized the importance of communications, IoT, and sensors and have paved the way for integrating sensors into the devices. Numerous business functions such as supply chain planning and logistics and manufacturing across industry verticals such as automotive, healthcare, consumer electronic devices, and aerospace & defense can be optimized, thus enabling increased profitability. The positive impact on the companies’ balance sheets due to the integration of sensor-enabled devices into the business processes has led to enormous demands for more such devices. Huge demands are further anticipated to be burdened on the semiconductor industry. The growth of the redistribution layer material in various IC manufacturing is therefore anticipated to rise rapidly during the forecast period, with IoT gaining more prominence over the coming years. Thus, the proliferation of IoT and connected devices across industry verticals across the globe is expected to provide an opportunity for the Europe redistribution layer material market.
On the contrary, fluctuation in raw material prices hampers the growth of Europe redistribution layer material market.
Based on type, the Europe redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held 48.8% share of the Europe redistribution layer material market in 2022, amassing US$ 7.62 million. It is projected to garner US$ 16.25 million by 2030 to expand at 9.9% CAGR during 2022-2030.
By application, the Europe redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held 76.1% share of the Europe redistribution layer material market in 2022, amassing US$ 11.88 million. It is projected to garner US$ 26.91 million by 2030 to expand at 10.8% CAGR during 2022-2030. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.
Based on country, the Europe redistribution layer material market is segmented into Germany, Austria, Italy, and the Rest of Europe. Germany held 68.4% share of Europe redistribution layer material market in 2022, amassing US$ 10.68 million. It is projected to garner US$ 25.32 million by 2030 to expand at 11.4% CAGR during 2022-2030.
Key players operating in the Europe redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd, among others.
o Highlights key business priorities in order to assist companies to realign their business strategies.
o The key findings and recommendations highlight crucial progressive industry trends in Europe redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
o Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
o Scrutinize in-depth Europe market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
o Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution
TABLE OF CONTENTS
1. Introduction
1.1 the Research Team Research Report Guidance
1.2 Market Segmentation
2. Executive Summary
2.1 Key Insights
2.2 Market Attractiveness
2.2.1 Market Attractiveness
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Europe Redistribution Layer Material Market Landscape
4.1 Overview
4.2 Porter’s Five Forces Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of New Entrants
4.2.4 Intensity of Competitive Rivalry
4.2.5 Threat of Substitutes
4.3 Ecosystem Analysis
4.3.1 Raw Material Suppliers
4.3.2 Manufacturers
4.3.3 End Use
5. Europe Redistribution Layer Material Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Growing Focus on AI-based Equipment and Tools
5.1.2 Increasing Demand from Automotive and Telecommunication Industries
5.2 Market Restraints
5.2.1 Fluctuation in Raw Material Prices
5.3 Market Opportunities
5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
5.4 Future Trends
5.4.1 Advancements in the Packaging Technology
5.5 Impact Analysis
6. Redistribution Layer Material Market – Europe Market Analysis
6.1 Europe Redistribution Layer Material Market Volume (Tons)
6.2 Europe Redistribution Layer Material Market Revenue (US$ Million)
6.3 Europe Redistribution Layer Material Market Forecast and Analysis
7. Europe Redistribution Layer Material Market Analysis – Type
7.1 Polyimide (PI)
7.1.1 Overview
7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
7.2 Polybenzoxazole (PBO)
7.2.1 Overview
7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.3 Benzocylobutene (BCB)
7.3.1 Overview
7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.4 Others
7.4.1 Overview
7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.4.3 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
8. Europe Redistribution Layer Material Market Analysis – Application
8.1 Fan-Out Wafer Level Packaging (FOWLP)
8.1.1 Overview
8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
8.2 2 5D/3D IC Packaging
8.2.1 Overview
8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
8.2.3 High Bandwidth Memory (HBM)
8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
8.2.4 Multi-Chip Integration
8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
8.2.5 Package on Package (FOPOP)
8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
8.2.6 Others
8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)
9. Europe Redistribution Layer Material Market – Country Analysis
9.1.1 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis – By Countries
9.1.1.1 Redistribution Layer Material Market Breakdown by Country
9.1.1.2 Germany Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
9.1.1.3 Germany Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
9.1.1.3.1 Germany Redistribution Layer Material Market Breakdown by Type
9.1.1.3.2 Germany Redistribution Layer Material Market Breakdown by Type
9.1.1.3.3 Germany Redistribution Layer Material Market Breakdown by Application
9.1.1.4 Austria Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
9.1.1.5 Austria Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
9.1.1.5.1 Austria Redistribution Layer Material Market Breakdown by Type
9.1.1.5.2 Austria Redistribution Layer Material Market Breakdown by Type
9.1.1.5.3 Austria Redistribution Layer Material Market Breakdown by Application
9.1.1.6 Italy Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
9.1.1.7 Italy Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
9.1.1.7.1 Italy Redistribution Layer Material Market Breakdown by Type
9.1.1.7.2 Italy Redistribution Layer Material Market Breakdown by Type
9.1.1.7.3 Italy Redistribution Layer Material Market Breakdown by Application
9.1.1.8 Rest of Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
9.1.1.9 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
9.1.1.9.1 Rest of Europe Redistribution Layer Material Market Breakdown by Type
9.1.1.9.2 Rest of Europe Redistribution Layer Material Market Breakdown by Type
9.1.1.9.3 Rest of Europe Redistribution Layer Material Market Breakdown by Application
10. Competitive Landscape
10.1 Heat Map Analysis by Key Players
10.2 Company Positioning & Concentration
11. Industry Landscape
11.1 Overview
11.2 Market Initiative
11.3 New Product Development
11.4 Merger and Acquisition
12. Company Profiles
12.1 SK Hynix Inc
12.1.1 Key Facts
12.1.2 Business Description
12.1.3 Products and Services
12.1.4 Financial Overview
12.1.5 SWOT Analysis
12.1.6 Key Developments
12.2 Samsung Electronics Co Ltd
12.2.1 Key Facts
12.2.2 Business Description
12.2.3 Products and Services
12.2.4 Financial Overview
12.2.5 SWOT Analysis
12.2.6 Key Developments
12.3 Infineon Technologies AG
12.3.1 Key Facts
12.3.2 Business Description
12.3.3 Products and Services
12.3.4 Financial Overview
12.3.5 SWOT Analysis
12.3.6 Key Developments
12.4 DuPont de Nemours Inc
12.4.1 Key Facts
12.4.2 Business Description
12.4.3 Products and Services
12.4.4 Financial Overview
12.4.5 SWOT Analysis
12.4.6 Key Developments
12.5 FUJIFILM Holdings Corp
12.5.1 Key Facts
12.5.2 Business Description
12.5.3 Products and Services
12.5.4 Financial Overview
12.5.5 SWOT Analysis
12.5.6 Key Developments
12.6 Amkor Technology Inc
12.6.1 Key Facts
12.6.2 Business Description
12.6.3 Products and Services
12.6.4 Financial Overview
12.6.5 SWOT Analysis
12.6.6 Key Developments
12.7 ASE Technology Holding Co Ltd
12.7.1 Key Facts
12.7.2 Business Description
12.7.3 Products and Services
12.7.4 Financial Overview
12.7.5 SWOT Analysis
12.7.6 Key Developments
12.8 NXP Semiconductors NV
12.8.1 Key Facts
12.8.2 Business Description
12.8.3 Products and Services
12.8.4 Financial Overview
12.8.5 SWOT Analysis
12.8.6 Key Developments
12.9 JCET Group Co Ltd
12.9.1 Key Facts
12.9.2 Business Description
12.9.3 Products and Services
12.9.4 Financial Overview
12.9.5 SWOT Analysis
12.9.6 Key Developments
12.10 Shin-Etsu Chemical Co Ltd
12.10.1 Key Facts
12.10.2 Business Description
12.10.3 Products and Services
12.10.4 Financial Overview
12.10.5 SWOT Analysis
12.10.6 Key Developments
13. Appendix
LIST OF TABLES
Table 1. Europe Redistribution Layer Material Market Segmentation
Table 2. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
Table 3. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
Table 4. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – Type
Table 5. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Type
Table 6. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – Application
Table 7. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – By Type
Table 8. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Type
Table 9. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Application
Table 10. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – By Type
Table 11. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Type
Table 12. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Application
Table 13. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – By Type
Table 14. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Type
Table 15. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Application
Table 16. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) – By Type
Table 17. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Type
Table 18. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) – By Application
Table 19. Company Positioning & Concentration
LIST OF FIGURES
Figure 1. Europe Redistribution Layer Material Market Segmentation, By Country
Figure 2. Porter’s Five Forces Analysis
Figure 3. Ecosystem: Europe Redistribution Layer Material Market
Figure 4. Market Dynamics: Europe Redistribution Layer Material Market
Figure 5. Europe Redistribution Layer Material Market Impact Analysis of Drivers and Restraints
Figure 6. Europe Redistribution Layer Material Market Volume (Tons), 2020 – 2030
Figure 7. Europe Redistribution Layer Material Market Revenue (US$ Million), 2020 – 2030
Figure 8. Europe Redistribution Layer Material Market Share (%) – Type, 2022 and 2030
Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)
Figure 10. Polyimide (PI) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)
Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)
Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 15. Others Market Volume and Forecasts To 2030 (Tons)
Figure 16. Others Market Revenue and Forecasts To 2030 (US$ Million)
Figure 17. Europe Redistribution Layer Material Market Share (%) – Application, 2022 and 2030
Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts To 2030 (US$ Million)
Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 21. Multi-Chip Integration Market Revenue and Forecasts To 2030 (US$ Million)
Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts To 2030 (US$ Million)
Figure 23. Others Market Revenue and Forecasts To 2030 (US$ Million)
Figure 24. Europe Redistribution Layer Material Market by Key Countries – Revenue (2022) (US$ Million)
Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)
Figure 26. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
Figure 27. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
Figure 28. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
Figure 29. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
Figure 30. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
Figure 31. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
Figure 32. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
Figure 33. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
Figure 34. Heat Map Analysis by Key Players
The List of Companies – Europe Redistribution Layer Material Market
1. Amkor Technology Inc
2. ASE Technology Holding Co Ltd
3. DuPont de Nemours Inc
4. FUJIFILM Holdings Corp
5. Infineon Technologies AG
6. JCET Group Co Ltd
7. NXP Semiconductors NV
8. Samsung Electronics Co Ltd
9. Shin-Etsu Chemical Co Ltd
10. SK Hynix Inc
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